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Semiconductor

The most suitable protection tapesfor wafer back-grinding and dicing of semiconductor processes.

We develop and supply special tapes for various chips to meet the customer's needs.
We manufacture tapes for Back-Grinding, Wafer Dicing, Epoxy Molding, and PKG Dicing in back-end process of LED & Semiconductor.

UV Tape

  • Dicing & Grinding
  • Prevent chip flying during dicing due to the excellent adhesion
  • Easily removed after UV irradiation

BG Tape

  • Back Grinding
  • Wafer surface protection during grinding

Mold Release Tape

  • Film Assist Molding
  • Easily removed due the low adhesion
  • Prevent resin bleed, mold flash

Lead Frame PI Tape

  • Film Assist Molding
  • Prevent resin bleed, mold flash
  • Silicone & Thermoplastic adhesive available
Grade Film Type Thickness
(㎛)
Single/
Double sided
Peel
Strength(A)
Peel
Strength(B)
Application
ST-PO518UV PO 170 Single 1500gf/in 20gf/in UV Dicing Tape
ST-5053BG PO 170 Single 90gf/in Wafer Back Grinding Tape
ST-5265AS-DC PO 140 Single 1600gf/in 95gf/in PKG UV Dicing Tape
ST-5748MF PET 48 Double 4gf/in Mold Release Tape
ST-5741MF(ASG) PET 42 Single 12gf/in Mold Release Tape
ST-U100 PU 113 Single 60gf/in LED Transfer Tape
Inquiry
+82-31-353-6034