The most suitable protection tapesfor wafer back-grinding and dicing of semiconductor processes.
We develop and supply special tapes for various chips to meet the customer's needs.
We manufacture tapes for Back-Grinding, Wafer Dicing, Epoxy Molding, and PKG Dicing in back-end process of LED & Semiconductor.
We manufacture tapes for Back-Grinding, Wafer Dicing, Epoxy Molding, and PKG Dicing in back-end process of LED & Semiconductor.
UV Tape
- Dicing & Grinding
- Prevent chip flying during dicing due to the excellent adhesion
- Easily removed after UV irradiation
BG Tape
- Back Grinding
- Wafer surface protection during grinding
Mold Release Tape
- Film Assist Molding
- Easily removed due the low adhesion
- Prevent resin bleed, mold flash
Grade | Film Type | Thickness (㎛) |
Single/ Double sided |
Peel Strength(A) |
Peel Strength(B) |
Application |
---|---|---|---|---|---|---|
ST-PO518UV | PO | 170 | Single | 1500gf/in | UV Dicing Tape | |
ST-8337LT | PI | 35 | Single | 50gf/in | QFN Back Side Tape | |
ST-PO518UV | PO | 170 | Single | 1500gf/in | 20gf/in | UV Dicing Tape |
ST-5053BG | PO | 170 | Single | 90gf/in | Wafer Back Grinding Tape | |
ST-5265AS-DC | PO | 140 | Single | 1600gf/in | 95gf/in | PKG UV Dicing Tape |
ST-5748MF | PET | 48 | Double | 4gf/in | Mold Release Tape | |
ST-5741MF(ASG) | PET | 42 | Single | 12gf/in | Mold Release Tape | |
ST-U100 | PU | 113 | Single | 60gf/in | LED Transfer Tape |
Inquiry
+82-31-353-6034sales@daehyunst.com